PCB Capabilities

PCB Specifications

Features	Capability	Notes	Patterns
Layer count	1,2,4,6 layers	The number of copper layers in the board.
Controlled Impedance	4/6 layer, default layer stack-up	Controlled Impedance PCB Layer Stackup JLCPCB Impedance Calculator
Material	FR-4	FR-4 Standard Tg 130-140/ Tg 155
Dielectric constant	4.5(double-sided PCB)	7628 Prepreg 4.6 2313 Prepreg 4.05 2116 Prepreg 4.25
Max. Dimension	400x500mm	The maximum dimension JLCPCB can accept
Dimension Tolerance	±0.2mm	±0.2mm for CNC routing, and ±0.4mm for V-scoring
Board Thickness	0.4/0.6/0.8/1.0/1.2/1.6/2.0mm	The thickness of finished board.
Thickness Tolerance ( Thickness≥1.0mm)	± 10%	e.g. For the 1.6mm board thickness, the finished board thickness ranges from 1.44mm(T-1.6×10%) to 1.76mm(T+1.6×10%)
Thickness Tolerance ( Thickness<1.0mm)	± 0.1mm	e.g. For the 0.8mm board thickness, the finished board thickness ranges from 0.7mm(T-0.1) to 0.9mm(T+0.1).
Finished Outer Layer Copper	1 oz/2 oz (35um/70um)	Finished copper weight of outer layer is 1oz or 2oz.
Finished Inner Layer Copper	0.5 oz (17.5um)	Finished copper weight of inner layer is 0.5oz by default.

Drill/Hole Size

Features	Capability	Notes	Patterns
Drill Hole Size	0.20mm- 6.30mm	Min. drill size is 0.20mm. Max. drill size is 6.30mm.
Drill Hole Size Tolerance	+0.13/-0.08mm	e.g. for the 0.6mm hole size, the finished hole size between 0.52mm to 0.73mm is acceptable.
Blind/Buried Vias	Don’t support	Currently we don’t support Blind/Buried Vias, only make through holes.
Min. Via hole size	0.2mm	For Single&Double Layer PCB, the minimum via hole size is 0.3mm;For Multi Layer PCB, the minimum via hole size is 0.2mm
Min. Via diameter	0.4mm	For Single&Double Layer PCB, the minimum Via diameter is 0.6mm;For Multi Layer PCB, the minimum via diameter is 0.4mm.
PTH hole Size	0.20mm – 6.35mm	The annular ring size will be enlarged to 0.15mm in production.
Pad Size	0.70mm- 6.35mm	The pad hole size will be enlarged 0.15mm in production.
Min. Non-plated holes	0.50mm	The minimum NPTH dimension is 0.50mm, Please add the NPTH in the mechanical layer or keep out layer.
Min. Plated Slots	0.65mm	The minimum plated slot width is 0.65mm, which is drawn with a pad.
Min. Non-Plated Slots	1.0mm	The minimum Non-Plated Slot Width is 1.0mm, please draw the slot outline in the mechanical layer(GML or GKO)
Min. Castellated Holes	0.60mm	The minimum diameter of castellated holes is 0.60mm.
Hole size Tolerance (Plated)	+0.13mm/-0.08mm	e.g. for the 1.00mm Plated hole, the finished hole size between 0.92mm to 1.13mm is acceptable.
Hole size Tolerance (Non-Plated)	±0.2mm	e.g. for the 1.00mm Non-Plated hole, the finished hole size between 0.80mm to 1.20mm is acceptable.
Rectangle Hole/Slot	Don’t support	We don’t make rectangle hole/slot,the rectangle hole/slot will be made as round or oval hole/slot by default.

Minimum Annular Ring

	Minimum annular ring	PTH	Patterns
1oz Copper	0.13mm	0.3mm
2oz Copper	0.2mm	0.3mm

Minimum clearance

Features	Capabilities	Patterns
Hole to hole clearance(Different nets)	0.5mm
Via to Via clearance(Same nets)	0.254mm
Pad to Pad clearance(Pad without hole, Different nets)	0.127mm
Pad to Pad clearance(Pad with hole, Different nets)	0.5mm
Via to Track	0.254mm
PTH to Track	0.33mm
NPTH to Track	0.254mm
Pad to Track	0.2mm

Minimum trace width and spacing

Copper weight	Min. Trace width	Min. Spacing	Patterns
H/HOZ (Inner layer)	5mil (0.127mm)	5mil (0.127mm)
1oz (Outer layer)	1/2 layers: 5mil (0.127mm) 4/6 layers: 3.5mil(0.09mm)	1/2 layers: 5mil (0.127mm) 4/6 layers: 3.5mil(0.09mm)
2oz (Outer layer)	8mil (0.2mm)	8mil (0.2mm)

BGA

Layer count	Min. BGA Pad Dimensions	Min. Distance Between BGA	Patterns
1/2 layers	0.4 mm	0.127mm
4/6 layers	0.25 mm	0.127mm

Solder Mask

Features	Capabilities	Notes	Patterns
Solder mask opening/ expansion	0.05mm	The solder mask should have a minimum of a 0.05 mm “growth/mask opening” around the pad to allow for any mis-registration.
Solder bridge	0.2mm(green) 0.254mm(other colors)	To have solder mask bridge, the spacing between copper pads edge must be 0.2mm (8mils) or more.
Solder mask color	green, red, yellow, blue, white, and black.	We use LPI (Liquid Photo Imageable) solder mask. It is the most common type of mask used today.
Solder mask dielectric constant	3.8
Solder mask thickness	10-15UM

Legend

Features	Capabilities	Notes	Patterns
Minimum Line Width	6 mil (0.153mm)	Characters width less than 6mil(0.153mm) will be unidentifiable.
Minimum text height	32 mil (0.8mm)	Characters height less than 32mil(0.8mm) will be unidentifiable.
Character width to height ratio	1:6	The preferred ratio of width to height is 1:6.
Pad To Silkscreen	0.15mm	The Minimum Distance Between Pad and Silkscreen is 0.15mm.

Board Outlines

Features	Capabilities	Notes	Patterns
Trace to Outline	0.2mm	Ships as individual board(Rounting):Trace to Outline≥0.2mm
Trace to V-cut line	0.4mm	Ship as panel with V-scoring: Trace to V-cut line≥0.4mm

Panelization

Features	Capabilities	Notes	Patterns
Panelization without space	0mm	The space between boards is 0mm.
Panelization with space	2mm	Make sure the space between boards should be ≥2mm,otherwise it will be hard to process for rounding.
Panelized Round board	≥20mmx20mm	The single round board size should be≥20mmx20mm. Panelize with stamp holes and add tooling strips on four board edges
Panelized castellated holes board	Panelize with stamp holes and add tooling strips on four board edges	The distance between castellated hole and board corner should be larger than 3mm. Recommended diameter of stamp hole is 0.5mm-0.8mm; Recommended distance between the two stamp holes is 0.2-0.3mm
Min. Width of Breakaway Tab	4mm	The minimum width of breakaway tab is 4mm. For breakaway with mouse-bites, the minimum width is 5mm.
Min. Edge Rails	3mm	If choosing panel by JLCPCB, we will add 5mm edge rails on both sides by default.